Difference between revisions of "Chip Reverse Engineering"

From Tmplab
(Microscope)
(Features)
Line 7: Line 7:
 
* 2 MP to 8 MP camera
 
* 2 MP to 8 MP camera
 
* Objective table to move the chip slowly (i.e. not by hand, too much shaking and imprecision)
 
* Objective table to move the chip slowly (i.e. not by hand, too much shaking and imprecision)
 +
* Reflected (incident) lighting
  
 
Feature we DON'T NEED:
 
Feature we DON'T NEED:

Revision as of 22:48, 5 July 2008

Microscope

Thanks to Karsten Nohl presentation at Hacker Space Fest, there's an interesting DIY approach for reverse engineering.

Features

These are the features we're looking for:

  • 500x magnification
  • 2 MP to 8 MP camera
  • Objective table to move the chip slowly (i.e. not by hand, too much shaking and imprecision)
  • Reflected (incident) lighting

Feature we DON'T NEED:

  • Confocal microscope (it seems, because we'll abrase/grind away the upper layers anyway and the bottom layers are opaque anyway too)

Leads

Links

Substrate

  • What kind of glue to use to attach the chip to solid/manoeuvrable support?

Software